HOME  |  CONTACT US  |  NEWS  |  ABOUT KESTER  |  FAQ  |  SEARCH
    English Deutsch Español Français    
Data Sheets Products & Services MSDS Sales & Distribution Technical Support Lead-Free Solutions

Products & Services
 
PRODUCTS
Product Catalog
Solderforms / Preforms
Thermal Interface Materials
Order Information
SERVICES
Metal Analysis
Solder Reclaim
 

Product Catalog

Search Again

Product Information  | Product Specifications  |  IPC  |  Bellcore  | Maximum Allowed Impurities (% By Weight)  |  Part Numbers

Product Information   Back to Top
275
LEAD-FREE |  No-Clean | Cored Wire
 
Kester “275” No-Clean Flux for cored solder wire was developed to provide superior wetting performance for hand soldering in the electronics industry. The chemistry is based on some of the same principles that have been safely used for years in mildly activated rosin fluxes. The use of “275” No-Clean Flux results in an extremely clear post-soldering residue without cleaning. The unique chemistry in Kester “275” was also designed to reduce spattering common to most core fluxes. Kester “275” No-Clean Flux is classified as Type ROL0 flux under IPC ANSI/J-STD-004 Joint Industry Standard. Performance Characteristics: ·Colorless translucent residues ·Improves wetting performance ·Excellent solderability and fast wetting to a variety of surface finishes ·Eliminates the need and expense of cleaning ·Low smoke ·Low odor ·Low spattering
View Data Sheet (English)
Find MSDS
View Marketing Materials (PDF)

Product Specifications   Back to Top
Residue Color: clear
Softening Point: 85
Solderabilty To Various Metallizations:
About this rating		 1
Diameter (inches): 0.031
Core Size: 50
Area of Spread (mm2): 419
Liquidus (°C): 183
Solidus (°C): 183


IPC   Back to Top
Silver Chromate: Pass
Classification: ROL0
SIR: Pass
Halide Content: <0.05 Copper Plate Corrosion: L Copper Mirror: L

Bellcore   Back to Top
SIR Pass
EM: Pass
Silver Chromate: Pass
Copper Mirror: L

Maximum Allowed Impurities (% By Weight)   Back to Top
Aluminum: 0.005
Antimony: 0.500
Arsenic: 0.030
Bismuth: 0.100
Cadmium: 0.002
Copper: 0.080
Gold: 0.050
Indium: 0.100
Iron: 0.020
Lead: 0.100
Nickel: 0.010
Silver: 0.100
Zinc: 0.003

Part Numbers    Back to Top
Alloy  Packaging  Americas  Asia Pacific  Europe  Japan  Brazil  
Sn63Pb37 1 lb., 0.031" diameter, core 50 24-6337-7600
UPC: 		Contact Us Contact Us Contact Us Contact Us
Sn63Pb37 1 lb., 0.015" diameter, core 50 24-6337-7604
UPC: 		Contact Us Contact Us Contact Us Contact Us
Sn63Pb37 1 lb., 0.020" diameter, core 50 24-6337-7602
UPC: 		Contact Us Contact Us Contact Us Contact Us
Sn63Pb37 1 lb., 0.025" diameter, core 50 24-6337-7616
UPC: 		Contact Us Contact Us Contact Us Contact Us
Sn63Pb37 1 lb., 0.050" diameter, core 50 24-6337-7612
UPC: 		Contact Us Contact Us Contact Us Contact Us
Sn63Pb37 1 lb., 0.062" diameter, core 50 24-6337-7614
UPC: 		Contact Us Contact Us Contact Us Contact Us
Sn96.5Ag3.0Cu0.5 1 lb., 0.015" diameter, core 58 24-7068-7608
UPC: 		Contact Us Contact Us Contact Us Contact Us
Sn96.5Ag3.0Cu0.5 1 lb., 0.020" diameter, core 58 24-7068-7603
UPC: 		Contact Us Contact Us Contact Us Contact Us
Sn96.5Ag3.0Cu0.5 1 lb., 0.025" diameter, core 58 24-7068-7617
UPC: 		Contact Us Contact Us Contact Us Contact Us
Sn96.5Ag3.0Cu0.5 1 lb., 0.031" diameter, core 58 24-7068-7601
UPC: 		Contact Us Contact Us Contact Us Contact Us
Sn96.5Ag3.0Cu0.5 1 lb., 0.050" diameter, core 58 24-7068-7606
UPC: 		Contact Us Contact Us Contact Us Contact Us
Sn96.5Ag3.0Cu0.5 1 lb., 0.062" diameter, core 58 24-7068-7607
UPC: 		Contact Us Contact Us Contact Us Contact Us
Sn96.5Ag3.0Cu0.5 1 lb., 0.040" diameter, core 58 24-7068-7605
UPC: 		Contact Us Contact Us Contact Us Contact Us