Difference between revisions of "TDIS Bi-monthly meeting, 2018 September 4th"
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+ | Back to [[Tagged DIS run group]] >> [[Tagged_DIS_run_group#Bi-monthly TDIS meetings|Bi-monthly TDIS meetings]] | ||
+ | |||
+ | [[TDIS Bi-monthly meeting, 2018 August 21|previous meeting]] << >> [[TDIS Bi-monthly meeting, 2018 September 18|following meeting]] | ||
+ | |||
+ | ==Agenda== | ||
*[https://hallaweb.jlab.org/wiki/images/9/9e/NDVCSRates_240718.pdf Pythia rates] | *[https://hallaweb.jlab.org/wiki/images/9/9e/NDVCSRates_240718.pdf Pythia rates] | ||
+ | |||
+ | ==Minutes== | ||
+ | Thia - reminded all of our internally-imposed PAC document deadline of 10/1/18, | ||
+ | coming up! | ||
+ | |||
+ | Dipangkar - found a new vendor that makes 25 micron material with self-curing epoxy, | ||
+ | will test! | ||
+ | |||
+ | Ed - still accumulating parts, but seems on track - expect to have an update next | ||
+ | meeting | ||
+ | |||
+ | Nilanga - will submit internal MRI application request at UVA, pleased that the mTPC | ||
+ | can run at room temperature | ||
+ | |||
+ | Alexandre/Paul - discussed preparing for SBS rates and looking towards trigger, | ||
+ | looked at simulation (with Rachel,..) - see slides on wiki, can also check vs. DVCS | ||
+ | actual and other checks ongoing | ||
+ | |||
+ | Nilanga - should we be concerned about radiation hardening the electronics? All: | ||
+ | Good question, will put in list of simulation "to do"'s... | ||
+ | |||
+ | Nilanga - other news: 80 ns shaping time will be implemented in SAMPA chips for | ||
+ | sPHENIX (who have also decided to use SAMPA as well) | ||
+ | |||
+ | Ed/Nilanga - yield for the chips has been "high", ~70% | ||
+ | |||
+ | Dipangkar reminded Thia to post updated outline for write-up - will do! | ||
+ | |||
+ | ==Organizational details== | ||
+ | |||
+ | :12:00 PM, JLab meeting room: CC F226 | ||
+ | : To join the Meeting: | ||
+ | :: https://bluejeans.com/550335940 | ||
+ | : To join via Room System: | ||
+ | :: Video Conferencing System: bjn.vc -or-199.48.152.152 | ||
+ | :: Meeting ID : 550335940 | ||
+ | :To join via phone : | ||
+ | :# Dial: | ||
+ | :#: +1.408.740.7256 (United States) | ||
+ | :#: +1.888.240.2560 (US Toll Free) | ||
+ | :#: +1.408.317.9253 (Alternate number) | ||
+ | :#: (see all numbers - http://bluejeans.com/numbers) | ||
+ | :# Enter Conference ID : 550335940 |
Latest revision as of 08:55, 17 September 2018
Back to Tagged DIS run group >> Bi-monthly TDIS meetings
previous meeting << >> following meeting
Agenda
Minutes
Thia - reminded all of our internally-imposed PAC document deadline of 10/1/18, coming up!
Dipangkar - found a new vendor that makes 25 micron material with self-curing epoxy, will test!
Ed - still accumulating parts, but seems on track - expect to have an update next meeting
Nilanga - will submit internal MRI application request at UVA, pleased that the mTPC can run at room temperature
Alexandre/Paul - discussed preparing for SBS rates and looking towards trigger, looked at simulation (with Rachel,..) - see slides on wiki, can also check vs. DVCS actual and other checks ongoing
Nilanga - should we be concerned about radiation hardening the electronics? All: Good question, will put in list of simulation "to do"'s...
Nilanga - other news: 80 ns shaping time will be implemented in SAMPA chips for sPHENIX (who have also decided to use SAMPA as well)
Ed/Nilanga - yield for the chips has been "high", ~70%
Dipangkar reminded Thia to post updated outline for write-up - will do!
Organizational details
- 12:00 PM, JLab meeting room: CC F226
- To join the Meeting:
- To join via Room System:
- Video Conferencing System: bjn.vc -or-199.48.152.152
- Meeting ID : 550335940
- To join via phone :
- Dial:
- +1.408.740.7256 (United States)
- +1.888.240.2560 (US Toll Free)
- +1.408.317.9253 (Alternate number)
- (see all numbers - http://bluejeans.com/numbers)
- Enter Conference ID : 550335940
- Dial: