TDIS Bi-monthly meeting, 2018 February 6

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  • Thia: TDIS Collaboration Meeting:
    • To happen in two weeks (Feb/22 starting at noon)! Mark your agenda!
    • Preliminary agenda in the email sent before (invited nDVCS to also present)
    • Indico schedule for Collaboration meeting to circulate soon
  • Message from Nilanga: mTPC - MRI/NSF:
    • Final submission to NSF made on Monday!
    • Nilanga: R&D plan formulated for studies towards constructing mTPC - to be discussed at TDIS Collaboration Meeting
  • Graham: MIT streaming workshop
    • Very promising discussions there
    • Discussion of ideas for EIC
    • TDIS and SOLID can benefit of these discussions as well
    • (See presented slides in attached file)
  • Ed: SAMPA chip test stand
    • Contacted several groups with parts already developed
    • Working to have a complete test stand in the Summer
    • (See presented slides in attached file)

Organizational details

11:00 AM, JLab meeting room: CC A110
To join the Meeting:
To join via Room System:
Video Conferencing System: -or-
Meeting ID : 550335940
To join via phone :
  1. Dial:
    +1.408.740.7256 (United States)
    +1.888.240.2560 (US Toll Free)
    +1.408.317.9253 (Alternate number)
    (see all numbers -
  2. Enter Conference ID : 550335940